SEOUL (Reuters) – Samsung Electronics said on Friday it broke ground at a new semiconductor research and development (R&D) complex in South Korea, where it plans to invest about 20 trillion won ($15 billion) by 2028 to drive leadership in chip technology.
The world’s largest memory chip maker and second-largest chip contract manufacturer said the new facility at Giheung, south of Seoul, will lead advanced research on next-generation devices and processes for memory and system chips, as well as development of new tech based on a long-term roadmap.
“Samsung Electronics is seeking to overcome the limits of semiconductor scaling,” it said in a statement.
The groundbreaking ceremony was attended by newly-pardoned Samsung Electronics Vice Chairman Jay Y. Lee and top executives.
“We need to continue our tradition of investing pre-emptively and emphasizing technology,” Lee said during the ceremony.
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Lee later met chip business employees and separately met with executives to discuss ways to secure technology to expand semiconductor leadership, Samsung said.
($1 = 1,327.7500 won)
(Reporting by Joyce Lee; editing by Richard Pullin)
